KAYA, M. Waste Printed Circuit Board (WPCB) Recovery Technology: Disassembly and Desoldering Approach. 2018. In Reference Module in Materials Science and Materials Engineering , Elsevier Inc., 1-19.

KAYA, M., (2018). Waste Printed Circuit Board (WPCB) Recovery Technology: Disassembly and Desoldering Approach. Reference Module in Materials Science and Materials Engineering (pp.1-19), Elsevier Inc..

KAYA, MUAMMER. "Waste Printed Circuit Board (WPCB) Recovery Technology: Disassembly and Desoldering Approach." In Reference Module in Materials Science and Materials Engineering , 1-19. Elsevier Inc., 2018

KAYA, MUAMMER. "Waste Printed Circuit Board (WPCB) Recovery Technology: Disassembly and Desoldering Approach." Reference Module in Materials Science and Materials Engineering , Elsevier Inc., 2018, pp.1-19.

KAYA, M. (2018) "Waste Printed Circuit Board (WPCB) Recovery Technology: Disassembly and Desoldering Approach", Reference Module in Materials Science and Materials Engineering . Elsevier Inc..

@bookchapter{bookchapter, author ={MUAMMER KAYA}, chaptertitle={Waste Printed Circuit Board (WPCB) Recovery Technology: Disassembly and Desoldering Approach}, booktitle={ Reference Module in Materials Science and Materials Engineering}, publisher={Elsevier Inc.}, city={},year={2018} }