Quantum Dot Patterning and Encapsulation by Maskless Lithography for Display Technologies

Ozdemir R., Van Avermaet H., Erdem O., Schiettecatte P., Hens Z., Aubert T.

ACS APPLIED MATERIALS & INTERFACES, cilt.15, sa.7, ss.9629-9637, 2023 (SCI-Expanded) identifier identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 15 Sayı: 7
  • Basım Tarihi: 2023
  • Doi Numarası: 10.1021/acsami.2c20982
  • Dergi Adı: ACS APPLIED MATERIALS & INTERFACES
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Chemical Abstracts Core, Compendex, EMBASE, INSPEC, MEDLINE
  • Sayfa Sayıları: ss.9629-9637
  • Anahtar Kelimeler: semiconductor nanocrystals, surface chemistry, QD-LED, blade coating, 3D printing, stereolithography SLA, LIGHT-EMITTING-DIODES, FLASH SYNTHESIS, SILICA SPHERES
  • Eskişehir Osmangazi Üniversitesi Adresli: Evet

Özet

For their unique optical properties, quantum dots (QDs) have been extensively used as light emitters in a number of photonic and optoelectronic applications. They even met commercialization success through their implementation in high -end displays with unmatched brightness and color rendering. For such applications, however, QDs must be shielded from oxygen and water vapor, which are known to degrade their optical properties over time. Even with highly qualitative QDs, this can only be achieved through their encapsulation between barrier layers. With the emergence of mini-and microLED for higher contrast and miniaturized displays, new strategies must be found for the concomitant patterning and encapsulation of QDs, with sub-millimeter resolution. To this end, we developed a new approach for the direct patterning of QDs through maskless lithography. By combining QDs in photopolymerizable resins with digital light processing (DLP) projectors, we developed a versatile and massively parallel fabrication process for the additive manufacturing of functional structures that we refer to as QD pockets. These 3D heterostructures are designed to provide isotropic encapsulation of the QDs, and hence prevent edge ingress from the lateral sides of QD films, which remains a shortcoming of the current technologies.