Diffusion bonding of nickel aluminide Ni75Al25 using a pure nickel interlayer

Torun O., Celikyurek İ.

INTERMETALLICS, cilt.16, sa.3, ss.406-409, 2008 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 16 Sayı: 3
  • Basım Tarihi: 2008
  • Doi Numarası: 10.1016/j.intermet.2007.11.011
  • Dergi Adı: INTERMETALLICS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.406-409
  • Eskişehir Osmangazi Üniversitesi Adresli: Evet

Özet

Diffusion bonding of Ni75Al25 using nickel as interlayer was carried out at 1000 degrees C under vacuum for various hold times. The microstructure of transition joints was revealed by scanning electron microscopy (SEM). Micrographs showed that a sound bonding formed continuously along the inter-face. Chemical compositions of the nickel interlayer and the bond interface were determined using energy dispersive spectroscopy (EDS) and X-ray diffraction studies were made on the fractured surface of all the specimens. Results demonstrated that interdiffusion between the nickel interlayer and the matrix was significant. The maximum shear strength was found as 233 MPa for bonded sample treated for 4 h. (C) 2007 Elsevier Ltd. All rights reserved.