Studies on the thermionic vacuum arc discharges in the vapors of Cu-Ag and Cu-Sn alloys

AKAN T., Ekem N., Pat S., Vladoiu R., Musa G.

JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, vol.7, no.5, pp.2489-2494, 2005 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 7 Issue: 5
  • Publication Date: 2005
  • Journal Name: JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.2489-2494
  • Keywords: thermionic vacuum arc, Cu-Ag and Cu-Sn alloys, thin films
  • Eskisehir Osmangazi University Affiliated: Yes

Abstract

The thermionic vacuum arc (TVA) discharges were studied in the vapors of various metals (Zn, Pb, Ag, Sn, Cu, Au, Co, Ti) and Cu-Ag and Cu-Sn alloys. Cu-Ag and Cu-Sn alloys in various mass ratios were prepared by using the TVA, and the TVA discharges were generated in the vapors of these alloys. The volt-ampere characteristics of the TVA discharges generated in the vapors of these alloys were investigated with respect to the ratio of Ag in the Cu-Ag alloy and Sn in the Cu-Sn alloy. Cu-Ag ailoy thin films with various mass ratios were deposited onto the glass substrates by using TVA discharges. The ratios of Cu and Ag in the thin Cu-Ag alloy films were found using the SEM-EDX microanalyses. The breakdown voltages of the TVA discharges depend on the boiling temperature of the material used to produce metal vapors.