Studies on the thermionic vacuum arc discharges in the vapors of Cu-Ag and Cu-Sn alloys
JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, vol.7, no.5, pp.2489-2494, 2005 (SCI-Expanded, Scopus)
- Publication Type: Article / Article
- Volume: 7 Issue: 5
- Publication Date: 2005
- Journal Name: JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS
- Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
- Page Numbers: pp.2489-2494
- Keywords: thermionic vacuum arc, Cu-Ag and Cu-Sn alloys, thin films
- Eskisehir Osmangazi University Affiliated: Yes
Abstract
The thermionic vacuum arc (TVA) discharges were studied in the vapors of various metals (Zn, Pb, Ag, Sn, Cu, Au, Co, Ti) and Cu-Ag and Cu-Sn alloys. Cu-Ag and Cu-Sn alloys in various mass ratios were prepared by using the TVA, and the TVA discharges were generated in the vapors of these alloys. The volt-ampere characteristics of the TVA discharges generated in the vapors of these alloys were investigated with respect to the ratio of Ag in the Cu-Ag alloy and Sn in the Cu-Sn alloy. Cu-Ag ailoy thin films with various mass ratios were deposited onto the glass substrates by using TVA discharges. The ratios of Cu and Ag in the thin Cu-Ag alloy films were found using the SEM-EDX microanalyses. The breakdown voltages of the TVA discharges depend on the boiling temperature of the material used to produce metal vapors.