Boron evaporation and related difficulties


Balbag M. Z., Pat S., Cenik M. I., AKAN T., Ekem N., Musa G.

JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, vol.9, no.4, pp.858-861, 2007 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 9 Issue: 4
  • Publication Date: 2007
  • Journal Name: JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.858-861
  • Eskisehir Osmangazi University Affiliated: No

Abstract

Boron is one of the materials of interest for the coming years. Used up to now as compounds element in a large number of chemicals or drugs, a growing interest for boron in order to be used as an element (atom) or simple diatomic compound (like boron carbide) can be observed. If we consider boron from its melting point of view, we can observe that boron is close to the refractory metals. Indeed, boron has a melting point of 2300 degrees C, other materials with higher melting points being Niobium (2468 degrees C), Molybdenum (2617 degrees C), Tantalum (2996 degrees C), Rhenium (3180 degrees C), Tungsten (3407 degrees C) and Carbon (3550 degrees C). Boron coating is one of the technologies recently considered to be of special interest due to the qualities of boron. The aim of this paper is to present the related difficulties of the evaporation of boron using Thermionic Vacuum Arc (TVA) Technology.