Selection of an oxidant for copper chemical mechanical polishing: Copper-iodate system

Anik M.

JOURNAL OF APPLIED ELECTROCHEMISTRY, vol.35, no.1, pp.1-7, 2005 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 35 Issue: 1
  • Publication Date: 2005
  • Doi Number: 10.1007/s10800-004-1763-4
  • Journal Name: JOURNAL OF APPLIED ELECTROCHEMISTRY
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.1-7
  • Keywords: CMP, copper, iodate, mixed potential theory, TUNGSTEN, SLURRIES, BEHAVIOR
  • Eskisehir Osmangazi University Affiliated: Yes

Abstract

Diagnostic criteria were developed to elucidate the reduction mechanism of an oxidant on a copper (Cu) surface at the corrosion potential. The corrosion potential of Cu tu was measured for various pH and iodate (IO3-) concentrations using the rotating disk electrode technique. According to the measured corrosion potentials, IO3- was an effective CMP oxidant only below pH Application of the diagnostic criteria on the Cu - IO3- system showed that the reduction of IO3- on Cu was under the mixed kinetic and diffusion control at the corrosion potentia l below pH 3. Above pH 3, however, the anodic process dominated over the cathodic process.